NCFlexE Printing Technology

Printing Technology

Printing electronics is an exciting opportunity for both new technology and new business.

Printing Technology A Key enabler for Printed Electronics

Flexible electronics is a fast growing business aiming at light-weight, low-cost, and large area applications. Printing has the potential to meet the needs of both device functionality and cost efficient mass production. At NCFlexE we work on utilising and adapting existing technologies of the printing industry to fulfil the requirements of printed electronics.

In general, the cost level that will create a real breakthrough for printed electronics in the market, can only be reached by switching to R2R production. Therefore, this facility that aims specifically at printed electronics will be an essential enabler for Indian companies to create applications based on printed electronics.

Process Flow

Our Expertise

Dedicated Team
Project engineers, Technicians with printing degree/experience
Theoretical understanding
Predicting & Modeling printing behavior
Ink characterization
Resolving Printing issues
Printing process development
Printing of functional inks
Printing parameters for different printing technologies
Pre and Post-treatment
Printing of functional devices
Printing process according to device requirements
Choice of technology and ink vs. functionality

Our Facilities

Pre-Treatment
Wet/Dry Cleaning
UV/Ozone Treatment
Plasma Treatment
Printing
Wirebar/Doctor blade Coating
Slot Die coating
Gravure/Flexo Printing
Inkjet Printing
Screen Printing
Sheet-to-Sheet AND Roll-to-Roll
Drying & Post Treatment
Precision Hotplates and Ovens
UV Curing
Photonic Sintering
NIR Drying
Lamination
Characterisation
Optical
Profilometer
Electrical
Functional

VCM * Roll-to-Roll Coater

*Versatile Coating Machine

Design Philosophy

Industrial scale processing on R&D level
Speed
Substrate width
Printing Technologies
Low Material Consumption
Modular design for maximum process flexibility
Any two print method combination
Interchangeable units
Drying/Sintering/Curing methods freely combinable
Extendable
Suitable for (Pre)pilot processing
High Througput
Easy/Fast switch over between modules
State-of-the-art and beyond components
KonicaMinolta, Heraeus, Vetaphone, MAAN, TSE, GEW, RK, Keyence, Reajet, Teknek, Frasier
Fulfilling requirements of Printed Electronics
Fast metal sintering
Printing Technologies
Alignment
Substrate Choices
Optimised for yield and device performance
Advanced sintering/curing
Contamination control
Non-contact forward turns
CR 10,000 environment
VOC compatible

Detailed Specifications

General
0 -10 m/min precision range, 50 m/min max
Substrate width: 10 cm – 30 cm
Tension range 1 – 200 N
Alignment accuracy 50 µm
Polymer films, metal foils, paper, fabric
Two consecutive coating steps
VOC compatible
Exchangeable coating modules
Printing Technologies
Inkjet printing
Slot Die coating 9/12’o clock position
Rotary Screen printing
Flexo printing
Direct Gravure printing
Inkjet marker printer
Drying/annealing technologies
Pre-drying unit (impingement dryer)
2 x 5 Impingement dryer units
individual controlled, with CR10,000 air supply
IR drying
UV curing
Flash sintering
Other features
SDBD Plasma and Corona pretreatment
Contact cleaning
Liner film removal and placement
Lamination hot/cold
No front side contact, use of air turns
Passive & Active antistatic control